DRAM is one of the crucial components of a smartphone. Especially with the increasing AI integration, its importance has only increased. However, a higher workload comes with higher heating. And to tackle this, manufacturers are working hard to develop energy-efficient chips. One of the leading companies in this race, SK hynix, has now announced a better heat dissipation tech in mobile DRAM.
SK hynix begins supply for mobile DRAM with better heat dissipation
SK hynix has announced that it has started supplying a new kind of DRAM chip that uses an ‘industry-first’ molding component designed to improve heat dissipation on smartphones. The company adds that this breakthrough technology improves the overall thermal conductivity of the chipset by a whopping 350%.
Until now, almost all the smartphone manufacturers have followed a traditional design pattern where the DRAM is stacked on top of the chipset die. While this ensures that some space is freed up, it can result in degraded performance and poor thermal management. The new High-K Epoxy Molding Compound, as announced by SK hynix, effectively addresses the current shortfalls while also improving the heat dissipation.
Breakthrough in mobile DRAM improves thermal resistance by 47%
Alongside the improved thermal conductivity, the new molding tech by SK hynix improves the thermal resistance in a vertical source of heat by 47%. The new tech could mean better efficiency and a smoother overall experience for the users. Lee Gyu-jei, head of Package Product Development at SK hynix, calls this a “meaningful achievement,” adding that it solves real problems faced by high-end smartphone users.
While the company has started supplying the mobile chips with the newer technology, it’s still uncertain when the smartphone manufacturers will adopt it. However, flagship devices that are going to launch in 2026 might be the first ones to come with the updated DRAM. If true, the next generation of flagships might have better stability, battery efficiency, and faster AI performance.
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